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OE-A Archive - Seite 2 von 3 - MSWtech - Enabling Printed Electronics

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OE-A

15 Okt. Speaking at eAsia on Oct 16th about flexible Electronics

Posted at 07:39h in Convention, OE-A, Printed Electronics by wmildner

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Speaking at the electronic forum at eAsia about flexible printed electronics on Oct 16th...

26 Sep. MSW part of the OE-A Meeting in Cambridge Oct 10-12th

Posted at 17:03h in Allgemein, OE-A, Printed Electronics by wmildner

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MSW (Wolfgang Mildner and Thomas Reitter) will be part of the next OE-A Meeting in Cambridge....

22 Feb. LOPEC 2017: March 28th to 30th

Posted at 15:11h in Lopec, OE-A, Printed Electronics by wmildner

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MSW will be exhibiting at LOPEC 2017 in Munich - the largest event on flexible printed electronics. If you plan to be there - don't hesitate to schedule a meeting...

20 Okt. Speaking at CES 2017 conference

Posted at 14:19h in ACROSS-THE-MARKET, Convention, OE-A, Printed Electronics by wmildner

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MSW will be speaking about Wearables and Printed Electronics at the CES (Consumer Electronic Show, Las Vegas) conference, 2017, Jan 6th afternoon. The talk will be at the OE-A session "Printed Electronics: Enabling the Future". Printed Electronics Advancing Healthcare and Wearable Innovations 3:30-4:30 PM January 6 LVCC, North Hall, N264...

14 Okt. OPE 17: Printed electronics is to integrate and to connect

Posted at 11:18h in Lopec, OE-A, Printed Electronics by wmildner

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Printed Electronics offers its highest value by combining functions and components See Article at OPE #17 ...

05 Juni Interactive Packaging enabled!

Posted at 15:30h in Convention, OE-A, Printed Electronics by wmildner

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Printed electronics enables the Packaging to be part of the #Internet of Everything Talk at Drupa Cube June 2nd, 2016...

10 Mai Drupa 2016: MSWtech will talk at Drupa Cube on June 2nd about interactive packaging

Posted at 12:56h in ACROSS-THE-MARKET, Convention, OE-A, Printed Electronics by wmildner

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OE-A Session June 2nd, 2:30pm Printed electronics enables interactive packaging Smart functionality: Thin, flexible, lightweight integrated sensors, light and logic hybrid integration enables silicon performance (e.g. for NFC Communication) ...

11 Apr. LOPEC 2016: MSW at „Printed Electronics Franken“

Posted at 16:39h in ACROSS-THE-MARKET, Convention, Lopec, OE-A, Printed Electronics by wmildner

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Successful Collaboration: 4 members teamed up for a joint booth at LOPEC 2016...

22 Jan. Wearable Technologies Munich: Introducing Printed Electronics

Posted at 11:20h in Convention, Lopec, OE-A, Printed Electronics by wmildner

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MSWtech will speak on Wednesday Jan 27th at Wearable technologies Conference in Munich (along ISPO 2016) to introduce printed Electronics and - OE-A - LOPEC ...

17 Juni OE-A and MSWtech visited Expo2015 in Milano

Posted at 13:36h in ACROSS-THE-MARKET, OE-A, Printed Electronics by wmildner

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1717OPV demonstrated as part of the german pavillon at EXPO 2015 in Milano...

OE-A

15 Okt. Speaking at eAsia on Oct 16th about flexible Electronics

26 Sep. MSW part of the OE-A Meeting in Cambridge Oct 10-12th

22 Feb. LOPEC 2017: March 28th to 30th

20 Okt. Speaking at CES 2017 conference

14 Okt. OPE 17: Printed electronics is to integrate and to connect

05 Juni Interactive Packaging enabled!

10 Mai Drupa 2016: MSWtech will talk at Drupa Cube on June 2nd about interactive packaging

11 Apr. LOPEC 2016: MSW at „Printed Electronics Franken“

22 Jan. Wearable Technologies Munich: Introducing Printed Electronics

17 Juni OE-A and MSWtech visited Expo2015 in Milano

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