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LOPEC 2026: MSWTech + Seho + TH Nürnberg - MSWtech - Enabling Printed Electronics
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LOPEC 2026: MSWTech + Seho + TH Nürnberg

03 Feb. LOPEC 2026: MSWTech + Seho + TH Nürnberg

Posted at 13:31h in Allgemein, Lopec, OE-A, Printed Electronics by wmildner
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At Booth B0.111, you will gain insights into:

  • Photonic-based selective reflow soldering concepts
  • Advantages for flexible substrates and printed electronics
  • Key results and learnings from the Photo-AVT project with SEHO’s new Infrabond System
  • Test, qualification, and reliability strategies from the joint MSWtech–BayflexSolutions Test Center