Printed electronics – what’s behind the buzz?

Printed electronics is a breakthrough key enabling technology. For years, companies, institutes and universities have researched it; now it targets the market in many applications. Standalone and in combination with silicon electronics, it adds new features to existing applications and opens new application areas and markets.

Hands bending a thin printed electronics film
FIG. 1Thin, flexible, printed

Electronics with these key features

Large area

Some applications need large areas with functional elements. Sensors can be applied as a matrix to measure and control in two dimensions.

Lightweight

Some applications require the lowest possible weight. Electronics based on thin film fulfils this requirement and adds flexibility.

Thin and flexible

Flexible substrates based on thin film add new possibilities for integration and packaging density.

Low cost

Roll-to-roll production is one of the most efficient ways to produce in large quantities – high-volume production enables low-cost products if produced at high yield.

A technology enabling many applications

All components can be combined and integrated into functional systems – integrated smart systems.

Display

Printed displays enable flexible, robust applications for mobile and other uses.

Lighting

Flexible, highly efficient lighting based on OLED technology (organic light-emitting diodes).

Sensors & components

Functional elements such as sensors, or electronic components such as transistors and resistors, up to fully functional circuits.

Organic photovoltaics

Energy from large-area, flexible printed solar cells.

Car tail light with printed, flexible lighting elements
FIG. 2Mobility: lighting
Flexible printed electronics worn on the wrist
FIG. 3Wearables: skin-worn electronics
Printed conductive traces on a fibre composite material
FIG. 4Lightweight design: functions in composites

The underlying technology

New materials (e.g. functional inks)

A new class of materials is used – for example organic functional materials that can act as conductors or even semiconductors. The materials can be put into solution and used in printing processes.

New process technology

Roll-to-roll printing, precise coating and high-precision printing (<10 µm).

New integration and packaging – hybrid approaches

Functional systems can be integrated on flexible substrates together with conventional electronics. MSW’s approach: use silicon electronics where performance is needed and combine printed and conventional components in a hybrid system.

Diagram: organic and printed electronics combine chemistry, printing and microelectronics
FIG. 5Chemistry, printing and microelectronics converge

A new industry, still in development

New supply and value chains need to be established to combine new materials with new process technologies and equipment.

New companies

New companies and start-ups are established to follow the new technologies; large companies pursue the technology to add value to their existing business.

New value chains

Materials, processes and equipment have to be brought together in new supply and value chains.

Networking is key

No company can do everything alone. Companies need to find partners and combine competences.

International network: OE-A provides access

Competences and product and service portfolios – the OE-A delivers transparent access.

Specific services for printed electronics

  • Introduction and value analysis
  • Basic and advanced education
  • Workshops and development programmes
  • International partnerships and networks
Smartphone with a flexible, curved display at a trade fair
FIG. 6Flexible displays reach consumer products

Let’s find the value of printed electronics for your product.

Tell us about your application, your questions or your next project. We look forward to your message.