MSWtech · Activities
Technical editorial illustration

At LOPEC 2026, MSWtech presented photonic selective reflow soldering, the Photo-AVT project with SEHO's Infrabond system, and test and qualification concepts with BayflexSolutions.

Topics at booth B0.111

  • Photonic-based selective reflow soldering concepts
  • Advantages for flexible substrates and printed electronics
  • Key learnings from Photo-AVT and SEHO’s Infrabond system
  • Testing, qualification and reliability strategies at the MSWtech–BayflexSolutions Test Center
This historical article has been migrated as a factual summary of the former site. The full original article text and original media must still be compared before final migration.